Unlike the slower conventional ALD method, which struggles with large-scale production and uniformity due to the need for vast vacuum chambers, our technology is 100x faster and operates without a vacuum. This innovation allows for individual wafer processing in seconds, achieving over 10,000 wafers per hour with superior properties and reduced precursor wastage, thereby lowering operational costs. Additionally, our technique facilitates the formation of a SiOx interlayer between silicon and alumina, further improving cell efficiency. This breakthrough not only enhances solar cell performance but also offers greater processing flexibility and operational efficiency, significantly cutting down on precursor costs and maintenance expenses.
Materials that are transparent to light but conduct like metals are critical for both silicon solar cells and thin film solar cells. Such materials are transparent conducting oxides (TCOs), and common materials are indium tin oxide (ITO) and fluorine-doped tin oxide (FTO).
NanoPrint's technology enables the rapid deposition of TCOs with high transmittance and conductivity. In particular, our system can be operated in CVD mode, which enables faster deposition, while still maintaining high uniformity. TCOs made with our system match the figures of merit of TCOs made by industry-standard sputter deposition, but with significantly lower capital intensity, and also reduced damage to the photoactive layers. This allows higher efficiencies to be achieved.
With our technology, we can also deposit continuously onto substrates, for example in a glass manufacturing line to produce conducting glass substrates for thin film solar cells or touchscreen displays.
Our technology's integration into roll-to-roll processing systems represents a significant advancement for the mass production of thin films on flexible substrates. This application is especially important for scaling up the manufacturing of flexible electronics and photovoltaics, offering a path toward more affordable and accessible technology.
Our technology is crucial for the production of flexible electronic components, such as displays, sensors, and thin-film transistors. The technology's ability to deposit uniform, conformal coatings at low temperatures is essential for working with flexible substrates that could be damaged by high heat.
Our technology can deposit a wide range of n- and p-type oxide semiconductors. Such materials can be used as active layers in photovoltaics, light-emitting diodes, photoelectrochemical cells, memristors and thin film transistors. Nanoprint's tech is inherently compatible with selective area deposition, which provides a route to the patterning of microelectronics and miniaturisation.
Our technology provides advanced solutions for applying protective coatings on various materials, including metals, polymers, and optical components. These coatings can improve corrosion resistance, wear resistance, and barrier properties, extending the life and performance of the coated products.
Our technology is used to create thin films with specific optical properties, such as anti-reflective coatings for lenses and displays or photonic crystals for advanced optical devices. This allows for the precise control over light manipulation, critical for both consumer electronics and specialized optical equipment.
Our technology is used to improve the performance and longevity of batteries and supercapacitors by depositing thin films that enhance electrode materials or serve as solid electrolytes. This application is key for the development of more efficient, reliable energy storage solutions.
By depositing catalytically active materials or support layers, our technology contributes to the development of more efficient catalysts for chemical reactions, including those used in fuel cells and industrial processes. This application is important for energy conversion technologies and sustainable chemical manufacturing.
